Oct. 18. 2019 | English | 繁中公益时报彩票网3d开机号分析
 
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積層陶瓷電容
電感
變壓器與直插式電感
漿料
銷售窗口

積層陶瓷電感 (MLCI)

MLCI 測試規格
Electrical characteristics
No. Item Test Condition Requirements
1 Inductance

a. Temperature: 25+/- 3℃
b. Relative Humidity: 45 to 75%RH
c. Measuring equipment and fixture:
1608(0603) HP 4291+16192A
1005(0402) HP 4287+16193A
0603(0201) HP 4287+16196C

Within specified tolerance.
2 Q Value a. Temperature: 25+/- 3℃
b. Relative Humidity: 45 to 75%RH
c. Measuring equipment and fixture:
1608(0603) HP 4291+16192A
1005(0402) HP 4287+16193A
0603(0201) HP 4287+16196C
In accordance with electrical specification.
3 DC Resistance a. Temperature: 25+/- 3℃
b. Relative Humidity: 45 to 75%RH
c. Measuring equipment: HP 4338
In accordance with electrical specification.
Mechanical characteristics
No. Item Test Condition Requirements
4 Appearance Inductors shall be visually inspected for visible evidence of defect. In accordance with specification.
5 Dimension Dimension shall be measured with caliper or micrometer In accordance with dimension specification.
6 Solder-ability Immerse a test sample into a methanol solution containing rosin and immerse into molten solder of 230+/-5°C for 5+/-1 seconds. More than 75% of the terminal electrode part shall be covered with fresh solder.
7 Bending Strength

Solder the chip to test jig then apply a force in the direction shown in below.
The soldering shall be done with the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.

1. No mechanical damage shall be observed.
2. Rdc-value: to meet the initial Spec.
8 Resistance to
Soldering Heat
Immerse a test sample into a methanol solution containing resin, preheat it at 120 to 150°C for 1 minutes and immerse into molten solder of 270+/-5°C for 10+/-1 seconds so that both terminal electrodes are completely submerged. No visible damage
Inductance variation within 10% Q variation within 20%
Reliability
No. Item Test Condition Requirements
9 Thermal Shock

Solder a test sample to printed circuit board, and conduct 5 cycles of test under the conditions shown as below.

0603 & 1005 operating temp. range: -55~125°C
1608 operating temp. range: -40~85°C

Cycle:
Maximum operating temp. /(30+/-3min)

Minimum operating temp. /(30+/-3min)

No visible damage.
Inductance variation within 10%.
Q variation within 20%.
10 High Humidity
State Life Test
Keep a test sample in an atmosphere with a temperature of 40+/-2°C, 90~95%RH for 500+/-12 hours. After the removal from test chamber, 2 to 3 hour of recovery under standard condition, and measurement shall be made after 24+/-2 hrs of recover under standard condition. No visible damage.
Inductance variation within 10%.
Q variation within 20%.
11 High Humidity
Load Life Test
Solder a test sample to printed circuit board then keep the test sample in an atmosphere with a temperature of 40+/-2°C, 90~95%RH for 500+/-12 hours while supplying the rated current. After the removal from test chamber, 2 to 3 hours of recovery under standard condition, and measurement shall be made after 24+/-2 hrs of recovery under standard condition. No visible damage.
Inductance variation within 10%.
Q variation within 20%.
12 High Temperature
State Life Test
Keep a test sample in an atmosphere with a temperature of 85+/-2°C for 500+/-12 hours. After the removal from test chamber, 2 to 3 hours of recovery under standard condition, and measurement shall be made after 24+/-2 hrs of recovery under standard condition. No visible damage.
Inductance variation within 10%.
Q variation within 20%.
13 High Temperature Load Solder a test sample to printed circuit board then keep the test sample in an atmosphere with a temperature of 85+/-2°C for 500+/-12 hours while supplying the rated current. After the removal from test chamber, 2 to 3 hours of recovery under standard condition, and measurement shall be made after 24+/-2 hrs of recovery under standard condition. No visible damage.
Inductance variation within 10%.
Q variation within 20%.
   
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